Apple will receive the first wave of TSMC’s 2nm production capacity, with the chipmaker reportedly launching its test-trial production this week.
According to reports, the iPhone maker has the debut production capacity of the chipmaker next year for its new 2nm process node.
The tech giant has also aimed to utilize the next-generation 3D advanced packaging platform System on Integrated Chip (SolC) on its next-gen M5 chips.
Moreover, Apple, Taiwan Semiconductor Manufacturing Co.’s (TSMC) largest customer, has secured the lead in booking 2nm advanced progress production capacity.
Reports also suggest its next-gen M5 chips with SolC advanced packaging are set to enter mass production in 2025.
Furthermore, sources noted that Apple’s looming SolC production is relatively simple compared to AI chips.
Meanwhile, TSMC must target at least double its output capacity next year to prepare for its large customers. Reports show that the chipmaker’s current production rate hits about 4,000 pieces but needs to climb by quantity in 2026.
Taiwan’s semiconductor manufacturer has installed 2nm process node equipment, and trial production is set for this week at its new lab in Boashan, Hsinchu.
Apple’s iPhone 17 will be released in 2026, following the launch of the iPhone 16 this year. Its core features TSMC’s new 2nm design.
TSMC Solid AI Chips Demand Benefits Apple and Nvidia
TSMC’s customers, such as Apple and Nvidia, have benefited, as robust AI has pushed the stock up.
The chipmaker is anticipated to report a 30.00% increase in Q2 profit amid solid demand for AI chips and Apple’s 2nm acquisition.
Meanwhile, reports show that the tech giant’s iPhone 15 Pro has an A17 Pro chip manufactured using TSMC’s 3nm process.
Also, TSMC’s 2nm performance is set to be 10.00% to 15.00% better than 3nm, and power consumption will be cut by up to 30.00%.
According to reports, the SolC technology stacks multiple functional chips vertically, creating a compact three-dimensional structure.
