Samsung Reveals Plan to Accelerate Delivery of AI Chips

On Thursday, Samsung Electronics unveiled its plans to offer clients a one-stop shop for acquiring artificial intelligence (AI) faster.

As part of its strategic approach, the tech giant is harnessing the power of its number one global memory chip foundry and chip packaging services, effectively leveraging its existing resources to drive the growth of AI.

Samsung reported that customers using a unified communication channel to coordinate with their memory chip, foundry, and chip packaging teams had reduced the production time for AI chips by approximately 20%, speeding up a process that typically takes weeks.

Furthermore, at the firm’s annual event, Siyoung Choi, the president and general manager of the foundry business, said that generative AI has completely changed the technology sector.

Choi added that by 2028, Samsung anticipates that global chip industry revenue will boost to $778.00 billion.

Moreover, Samsung revealed its business guidelines, underlining its technological innovations and aspirations for the AI era.

Meanwhile, during a briefing before the event, Marco Chisari, executive vice president of foundry sales and marketing, stated that the company considers OpenAI CEO Sam Altman’s optimistic forecasts regarding the increasing demand for AI chips credible.

AI Chips Boom as Samsung Approach Hopes to Gain Strength

Samsung’s integrated approach aims to meet the rising demand for AI chips by enhancing data training and inference efficiency with reduced power.

In addition, the South Korea-based company has highlighted its advanced chip design, gate-all-around (GAA), a transistor architecture that enhances chip performance and lowers power consumption.

According to reports, GAA technology is crucial for developing more powerful AI chips as semiconductor fabrication reaches physical scaling limits.

Despite competition from Taiwan Semiconductor Manufacturing Company, a leading foundry worldwide, Samsung began using advanced chips first and plans to mass-produce second-generation 3-nanometer GAA chips in the latter half of 2024.

The tech giant’s 2-nanometer chip process, with backside power rails for better delivery, will start mass production in 2027 for high-performance computing.